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Solder Preform

The manufacturing process of Preform Solder starts with a material ingot purity inspection. Our rigorous control of material excludes contamination in all sebsequent processes including casting, extrusion rolling and punching.


  • Soldering Connector's terminal and mother board.
  • For dipping IC, assembly of printed circuit board.
  • Assembly of condenser and electronic parts.
  • Sealing of ceramic package, etc.
  • For performing material of diode, power-transistor, Semiconductor.
  • Parts assembly and inserting.
  • Soldering lead-wire of hybrid IC.