Solder Preform

The manufacturing process of Preform Solder starts with a material ingot purity inspection. Our rigorous control of material excludes contamination in all sebsequent processes including casting, extrusion rolling and punching.

Uses

• Soldering Connector's terminal and mother board.
• For dipping IC, assembly of printed circuit board.
• Assembly of condenser and electronic parts.
• Sealing of ceramic package, etc.
• For performing material of diode, power-transistor, Semiconductor.
• Parts assembly and inserting.
• Soldering lead-wire of hybrid IC.