Soldering Flux

Flux chemically removes oxide film from the to-be soldered metal surface, and the molten solder surface, thereby exposing solderable metal surfaces. Flux is therefore indispensable in all soldering processes, including PC board and special metals. It must possess the correct characteristics to meet specific application requirements. From Senju Metal Industry's long experience, we have developed various types of flux, including PC board flux, all of which provide unrivaled performance.

Flux: Typical Products & Specification

Products			Physical Property				Features & Uses
			Solid Content (wt %)	Specific Gravity (20 °C)	Viscosity (20°C) (cP)	Chlorine Content (%)
Resin Type	General Use	PO-F-1010S	15	0.823	4.5	0.07	Chip mounted & high density boards, standard type.
		PO-F-1010K	17	0.825	4.1	0.07	Prevention of dew condensation.
		ES-1061SP-2	15	0.826	4.0	0.09	Pb-free soldering.
	Lower Residue	PO-F-009M	9	0.807	3.2	0.06	Chip mounted & high density boards, lower residue, spray coating.
		PO-F-710	9	0.807	3	0.06	Chip mounted & high density boards, spray coating, lower residue.
	RMA	SR-209	12	0.820	3.7	*RMA	Lower residue, non-cleaning, lusterless type.
		SR-12	12	0.818	3.6	*RMA	Lower residue, non-cleaning. lustrous type.
Water-Soluble Type	General Use	WF-2050	20	0.887	6.7	2.00	High density electronic boards.
	Preliminary soldering of parts	WF-3041	46	1.156	6.1	0.000	Soldering of nickel & copper based alloys, halogen-free.
Tinning Flux		T-1	1	0.829	3.0	0.16	Tinning for lead wire, negligible residues.

* The procedure is similar to chlorides and bromides test.

There are many types of flux, depending on the required application and performance. We supply a wide choice of fluxes including the resin type and water soluble type to meet every needs.