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Soldering Flux

Flux chemically removes oxide film from the to-be soldered metal surface, and the molten solder surface, thereby exposing solderable metal surfaces. Flux is therefore indispensable in all soldering processes, including PC board and special metals. It must possess the correct characteristics to meet specific application requirements. From Senju Metal Industry's long experience, we have developed various types of flux, including PC board flux, all of which provide unrivaled performance.

Flux: Typical Products & Specification

Products Physical Property Features & Uses
Solid
Content
(wt %)
Specific
Gravity
(20 °C)
Viscosity
(20°C)
(cP)
Chlorine Content
(%)
Resin
Type
General
Use
PO-F-1010S 15 0.823 4.5 0.07 Chip mounted & high density boards, standard type.
PO-F-1010K 17 0.825 4.1 0.07 Prevention of dew condensation.
ES-1061SP-2 15 0.826 4.0 0.09 Pb-free soldering.
Lower
Residue
PO-F-009M 9 0.807 3.2 0.06 Chip mounted & high density boards, lower residue, spray coating.
PO-F-710 9 0.807 3 0.06 Chip mounted & high density boards, spray coating, lower residue.
RMA SR-209 12 0.820 3.7 *RMA Lower residue, non-cleaning, lusterless type.
SR-12 12 0.818 3.6 *RMA Lower residue, non-cleaning. lustrous type.
Water-Soluble
Type
General Use WF-2050 20 0.887 6.7 2.00 High density electronic boards.
Preliminary
soldering of parts
WF-3041 46 1.156 6.1 0.000 Soldering of nickel & copper based alloys, halogen-free.
Tinning Flux T-1 1 0.829 3.0 0.16 Tinning for lead wire, negligible residues.

* The procedure is similar to chlorides and bromides test.

There are many types of flux, depending on the required application and performance. We supply a wide choice of fluxes including the resin type and water soluble type to meet every needs.