ECO-REFLOW SNR-725 (SNR-846)

N2 Reflow Oven for Lead-Free Soldering for Semiconductor
Highly acclaimed reflow oven meets needs for high reliability, uniform oxygen concentration and low nitrogen gas consumption in semidoncductor packaging and industrial equipment industries.

Features

• An airtight muffle structure maintains an uniform oxygen concentration of 100 ppm or less.
  Low nitrogen gas consumption (100 ppm at 300 l/min.) has been achieved in every zone of the oven.
• Porous ceramic, far-infrared radiation and α-flow heating system, all combined, achieve a minimized ΔT.
• The standard model comes with an automatic flux recovery system.
• High-efficiency adiabatic structure saves power consumption. (35kW for 7 zones)
  
• High degree of freedom in profile setting.
  
• Available for high temp. reflow (max. 350°C) [Option]

SNR-725 (SNR-846) Standard Specification

Dimensions	SNR-725: 5,340 mm (L) x 1,143 mm (W) x 1,385 mm (H) SNR-846: 5,940 mm (L) x 1,303 mm (W) x 1,385 mm (H)
Conveyor speed	0.3 to 2.0 m/min. (Variable)
Pass line	900±20 mm, in-line design available
Heater system	Far-infrared panel heaters and hot air blowers used in combination (14 units in 7 heating zone for SNR-725; 16 units in 8 heating zone for SNR-846)
Cooling unit	Top-and-bottom cold blast cooling by coolant circulation
Power supply (Max.)	200 VAC, 40kW, three-phase [SNR-846/53kW]
PCB access	Width: 50 to 250 mm for SNR-725; 50 to 460 mm for SNR-846 Length: 100 to 400 mm for SNR-725; 100 to 500 mm for SNR-846
PCB access height	Upper side: 10 mm, Underside: 5 mm (Variable)
Operation control	Microcomputer
Weight	Approx. 1,800 kg (SNR-725) and 2,400 kg (SNR-846)
Options	Customer-specified color, automatic width adjuster, warp prevention mechanism, board fall detector, and others

* Design and specifications are subject to change without notice for improvements of system performance.