ECO-REFLOW SNR-615

Small N2 Reflow Oven for Lead-Free Soldering
An advanced small reflow oven for semiconductor packaging,
hybrid components, and solder formation of SMT assemblies.

Features

• Far infrared ray panel heaters and convection blow heating system achieve a minimized ΔT. 　
• Individual heater temperature settings provide high degree of freedom in a trapezoidal profile setting.
  Top and bottom heating system offers high degree of reproducibility in reflow profile.
• Air tight muffle structure furnace features 100 ppm or less oxygen concentration.
  Low nitrogen consumption of 100 ppm at 200 liter/min attainable in every zone.
  (Component's height is under 10 mm)
• Standard flux recovery mechanism at heating zone [Option]
  Recovered flux is automatically collected after an operation is completed.
• Energy-saving design.
  Highly efficient adiabatic structures reduce electric power consumption.
• Suitable for high temp. reflow (max. 350°C)

SNR-615 Standard Specification

Dimensions (mm)	2,670L x 1,100W x 1,340H
Conveyor speed	0.1 to 1.0 m/min. （Variable）
Pass line	900 ± 20mm
Heater system	Far-infrared panel heaters and hot air convective blowers used in combination（6 heating zones)
Power supply	200VAC 43kW, 3-phase
Cooling unit	Top-and-bottom blast cooling by nitrogen gas
PCB access	Width：50 to 150mm, Length：100 to 300mm
PCB access height	Upper：10-20 mm, Under：5 mm
Operation control	PLC + Microcomputer
Weight	1,700Kg (Approx)
Options	Customer-specified color; automatic width adjuster; flux automatic recovery mechanism, oxygen automatic concentration control, and others

* Design and specifications are subject to change without notice for improvements of system performance.