SAI-838N (SAI-638N)

Air Reflow Oven for Lead-Free Soldering
Ultra heating equlization achieve a best processing profile for Lead-Free reflow soldering in nitrogen gas ambient.

Features

• Homogeneous oxygen concentration in oven by the latest nozzels.
• Easy to control PCB heating temperatures on digital setting.
• Keep on optimized profile through continuous PCB processing.
• Stable nitrogen ambient from heating to cooling zoone.
• Equiped automatic flux recovery system.
• Innovative α-flow heating system has achieved to minimized ΔT.
• Standard flux recovery mechanism.

Efficient top and bottom heating mechanisms

Tested PWB: Both sides surface mounted 250 x 180 x 1.6mm FR=4

SAI-838 (SAI-638) Standard Specification

Dimensions [mm]	Length: 4,250 Width: 1,200 Height: 1,450 [3,530 X 1,200 X 1,450 / 6 zones]
Transfer conveyor	Pin type chain conveyor
Conveyor speed	Speed: 0.3 to 1.6m / min. (variable)
Pass line	900 +20mm , -10mm in-line design aveilable
P.C.B. access	Width: 50 to 380mm, Length: 100 to 540mm
Device's access height	Upper: 20mm, Under: 20mm
Photoelectric sensor	Detection of board jamming and falling
Power (max.)	200V AC, 3-Phase, 45kw (35kw / 6 zones)
Heater system	Hotair circulation panel heaters
Cooling unit	Scirocco fan Top: 2 Bottom:1
Operation / Control	Sequential control
Weight	Approx. 1,500kg (1,400 kg / 6 zones)
Options	Customer-specified color, automatic width adjuster, and others

Jointly developed for Lead-Free soldering using our material technology and ATEC TECTRON's thermal control technology.

Please contact us for further details and technical information. As a leading manufacturer of soldering flux and soldering related materials, we would be pleased to provide advanced solutions in soldering technology. Design and specifications of system and equipment are subject to change without notice.