CX-85

Clean Reflow Oven for Semiconductor Assembly in Clean Room

This clean reflow oven is designed for high–precision applications like information technology and mobile telecommunication devices as well as for bare-mounting applications. It excels at face–up packaging by wire bonding and face–down mounting by FCB combining a state-of-the-art heating system with a high quality walking beam conveyor. These components enable high–quality solder bump formation at the wafer level.

Features

• Cleanness inside oven : achieving class 1000
  (by walking beam conveyance method and radiation heating method)
• Oxygen concentration inside oven : 20ppm or lower (by a hermetic chamber structure)
• Flux fume combustion unit : flux fumes generated inside the furnace are burned by heat. Collection of tar-like flux is controlled
• Highly flexible temperature setting : heaters in five zones along the conveyor direction controlled separately in three blocks and a separate reflow zone make a highly flexible temperature setting possible (16-surface control)
• Conveyor mechanism : the walking beam conveyor system and cycle–time operation allow stable heating in each zone in a dust free environment
• Radiant heating : the use of radiant heating eliminates the need for forced convection reducing defective bump surface finishes due to hot blasts to a minimum
• Applicable to high-temperature solder : Lead-Free solder and other types of high-temperature solders can be used

ø0.1mm Sparkle ball

After ball mounting

Major Usage

• Bump formation on W-CSP (Wafer Level-CSP)
• FCB / flip-chip bonding (soldering, electroconductive paste curing etc.)

CX-85 Standard Specification

Power		200 VAC; 50/60 Hz; 3-phase; 26 kw; 150 A
Dimensions		Total length: 2,980 mm; total width: 1,100 mm; total height: 1,260 mm
Weight		1,300kg
Pass line		900 ±20 (mm)
Applicable board width		ø6 inch, ø8 inch
Continuous Operation		370°C (Wafer surface temperature)
Heating Unit	Number of zones	5 zones
	Heating length	1,500mm (300 mm x 5 zones)
	Heater capacity	Zones 1, 2 and 3: 1.5kw x 4 surfaces 200 VAC (Zones 2 and 3 do not have an underside.) Zones 4 and 5: (500 W x 3) x 4 surfaces; 100 VAC (3-block division / 1 surface)
	Control method	PID control, Individual control of each heater (16 surfaces in total)
Cooling Section	Cooling length	300mm
	Cooling method	N2 gas purging method
Conveyor Section	Method of conveyance	Walking beam method
	Conveyor direction	Left to Right (when viewed from the front of equipment)
	Effective conveyor width/height	150 to 200mm, 10mm above conveyor surface
	Cycle pitch	300mm
Exhaust system		Injector system (Forced exhaust from heater)
Nitrogen gas consumption		250 liters / min. (Oxygen concentration inside furnace: 20 ppm or less during continuous wafer input)
Flux fume combustion	Power capacity	10kw (Combustion unit) 3kw (Exhaust tube hot insulation heater)
	Temperature adjustment range	Normal temperature to 800°C
Cleanliness level		Class1000 (0.5µm)

Install a suction duct at the inlet/exit of the furnace when it is installed inside a clean room.

As a total supplier for bare chip and fine mounting, we can provide support on facility, material and manufacturing method. Loaders and unloaders are available from us upon your purchase. Product specifications and design are subject to change for improvement without notice.