Sparkle Ball

Solder Ball

Sparkle Balls are very small spheres of high-purity solder for micro soldering system. The most important advantages of solder balls are their very clean surfaces and exact solder quantity control. Solder balls are packed in argon gas for delivery to the user. A wide range of solder types including low and high temperature alloys can be produced as Sparkle Ball.

SMIC Sparkle Ball

Type	Form	Diameter (mm)	Features
S type		0.1 to 1.0	Diameter diviation is within ±5µm (under 0.3ø) within ±10µm (under 0.3ø to under 0.5ø) within ±20µm (under 0.5ø to) ±10µm Type is available on request.

* Micro balls less than 0.1 dia, Cu or Ag cored ball are also available on request.

Uses

Conductor bumps on hybrid ICs, power transistors
soldering miniature parts such as crystal resonators and diodes.

Most suitable for Ball Grid Array, Multi Chip Module, Chip On Board
Flip Chip and CSP.

Micro-soldering Fluxes

Application method		Product	Physical property	Solid content	Viscosity (Pa-S) (25ºC)	Flux type Chlorine content
Resin Type	Pin transcription	DELTALUX 529D-1n	Paste	62.5%	19	RMA(0%)
	Ball transcription	DELTALUX 533	Paste	67%	9	RA(0.2%)
	Dispenser	DELTALUX 527N	High viscous liquid	70%	13	RMA(0%)
	Printing	DELTALUX 523H	Paste	68%	120	RMA(0.05%)
Water-soluble Type	Pin & Ball transfer	Sparkle Flux WF-6300LF	Paste	80%	18	-----
	Dispenser	Sparkle Flux WF-6090	High viscous liquid	79%	110%	-----