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Sparkle Ball

Solder Ball

Sparkle Balls are very small spheres of high-purity solder for micro soldering system. The most important advantages of solder balls are their very clean surfaces and exact solder quantity control. Solder balls are packed in argon gas for delivery to the user. A wide range of solder types including low and high temperature alloys can be produced as Sparkle Ball.

SMIC Sparkle Ball

Type Form Diameter (mm) Features
S type 0.1 to 1.0 Diameter diviation is
within ±5µm (under 0.3ø)
within ±10µm (under 0.3ø to under 0.5ø)
within ±20µm (under 0.5ø to)
±10µm Type is available on request.

* Micro balls less than 0.1 dia, Cu or Ag cored ball are also available on request.

Uses

Conductor bumps on hybrid ICs, power transistors
soldering miniature parts such as crystal resonators and diodes.

Most suitable for Ball Grid Array, Multi Chip Module, Chip On Board
Flip Chip and CSP.

Micro-soldering Fluxes

Application method Product
Physical
property
Solid
content
Viscosity
(Pa-S)
(25ºC)
Flux type
Chlorine content
Resin
Type
Pin
transcription
DELTALUX 529D-1n Paste 62.5% 19 RMA(0%)
Ball
transcription
DELTALUX 533 Paste 67% 9 RA(0.2%)
Dispenser DELTALUX 527N High viscous
liquid
70% 13 RMA(0%)
Printing DELTALUX 523H Paste 68% 120 RMA(0.05%)
Water-soluble
Type
Pin & Ball transfer Sparkle Flux
WF-6300LF
Paste 80% 18 -----
Dispenser Sparkle Flux
WF-6090
High viscous
liquid
79% 110% -----