Exhibition Report: SEMICON Taiwan 2011
Senju Metal Industry Co., Ltd. has exhibited at SEMICON Taiwan 2011, from September 7 to 9, 2011 in Taiwan. We had a very large number of visitors coming to our booth, for which we would like to express our gratitude.
![]()
The exhibition booth was designed around the theme "Creating an Era Where Materials Can Be Selected to Match Desired Applications."
![]()
Special focus has been given to "cost reduction." M40 and M46 were prominently featured.
![]()
Customers examining new PPS product and 20μm solder ball.
![]()
Sales representative explains 50μm solder ball mounting
for large wafers.
![]()
Salesman answering questions from customers.
![]()
Many visitors expressed very strong interest toward semiconductor packaging.
Our sales reps giving enthusiastic talks in front of exhibit panels.
![]()
After a business negotiation...
Our employee explains 3D mouting technology with copper cored spheres.
![]()
Tsuruta manager giving an official lecture hosted by SEMICON Taiwan.
Giving an enthusiastic presentation about new products and technologies.
![]()
Audience paying close attention to out presentation.
Customers gathered for our presentation.
![]()
An employee was present at the booth wearing traditional Japanese Yukata.
Aggressively appealing new products.

