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Exhibition Report: SEMICON Taiwan 2011

Senju Metal Industry Co., Ltd. has exhibited at SEMICON Taiwan 2011, from September 7 to 9, 2011 in Taiwan. We had a very large number of visitors coming to our booth, for which we would like to express our gratitude.

Exhibition Handouts

The exhibition booth was designed around the theme "Creating an Era Where Materials Can Be Selected to Match Desired Applications."

Special focus has been given to "cost reduction." M40 and M46 were prominently featured.

Customers examining new PPS product and 20μm solder ball.


Sales representative explains 50μm solder ball mounting for large wafers.

Salesman answering questions from customers.

Many visitors expressed very strong interest toward semiconductor packaging.

Our sales reps giving enthusiastic talks in front of exhibit panels.

After a business negotiation...

Our employee explains 3D mouting technology with copper cored spheres.

Tsuruta manager giving an official lecture hosted by SEMICON Taiwan.

Giving an enthusiastic presentation about new products and technologies.

Audience paying close attention to out presentation.

Customers gathered for our presentation.

An employee was present at the booth wearing traditional Japanese Yukata.

Aggressively appealing new products.