Home > News > Trade Show Information > Exhibition Handouts: SEMICON China 2011

Exhibition Handouts: SEMICON China 2011

Catalogue

  • PDF ChineseECOSOLDER CORED — Lead-Free Flux Cored Solder —

Leaflet

  • ALL PDF ChineseFULL DOWNLOAD [5.5MB / 14 pages]
  • PDF ChineseMicro-Bumping Materials
  • PDF ChineseSolder Transfer using
    Precoated by Powder Sheets (PPS)
  • PDF ChineseMicro-Bumping Solder Paste
  • PDF ChineseM705-TVA-HF Transfer Paste
  • PDF ChineseSoldering Flux for Semiconductors
  • PDF ChineseSn-Bi Solder Paste with Joint-Reinforcing Function
  • PDF ChineseL20 & L23 Solder for Low-Temperature Soldering
  • PDF ChineseM61 Solder Ball Material for
    Drop Impact Resistance
  • PDF ChineseIndustrial Analysis Service Ltd.
  • PDF ChineseCorporate Social Responsibility
    - Harmony with the Environment
  • PDF ChineseEliminating Conflict Minerals / Conflict Metals
  • PDF ChineseSoldering Material Using Copper Ball Cores
  • PDF ChineseDedicated Micro Ball Reflow Oven SNR-1345MB