Exhibition Handouts: SEMICON China 2011

Catalogue

• ECOSOLDER CORED — Lead-Free Flux Cored Solder —

Leaflet

• FULL DOWNLOAD [5.5MB / 14 pages]
• Micro-Bumping Materials
• Solder Transfer using
  Precoated by Powder Sheets (PPS)
• Micro-Bumping Solder Paste
• M705-TVA-HF Transfer Paste
• Soldering Flux for Semiconductors
• Sn-Bi Solder Paste with Joint-Reinforcing Function
• L20 & L23 Solder for Low-Temperature Soldering
• M61 Solder Ball Material for
  Drop Impact Resistance
• Industrial Analysis Service Ltd.
• Corporate Social Responsibility
  - Harmony with the Environment
• Eliminating Conflict Minerals / Conflict Metals
• SCQI Award from Intel Corporation
• Soldering Material Using Copper Ball Cores
• Dedicated Micro Ball Reflow Oven SNR-1345MB