Home > News > Trade Show Information > Exhibition Handouts: INTERNEPCON JAPAN & IC PACKAGING TECHNOLOGY EXPO 2011

Exhibition Handouts: INTERNEPCON JAPAN & IC PACKAGING TECHNOLOGY EXPO 2011

Catalogue

  • ChinesePDF EnglishECOSOLDER CORED — Lead-Free Flux Cored Solder —

Leaflet

  • ChineseALL PDF EnglishFULL DOWNLOAD [11MB / 24 pages]
  • ChinesePDF EnglishMicro-Bumping Materials
  • ChinesePDF EnglishSolder Transfer using
    Precoated by Powder Sheets (PPS)
  • ChinesePDF EnglishMicro-Bumping Solder Paste
  • ChinesePDF EnglishM705-TVA-HF Transfer Paste
  • ChinesePDF EnglishSoldering Flux for Semiconductors
  • ChinesePDF EnglishLow-Silver Flow Soldering Materials
  • ChinesePDF EnglishM40 Series of Low-Cost,
    High-Quality Low-Silver Solder Pastes
  • ChinesePDF EnglishLineup of Flux-Cored Solders
  • ChinesePDF EnglishSn-Bi Solder Paste with Joint-Reinforcing Function
  • ChinesePDF EnglishL20 & L23 Solder for Low-Temperature Soldering
  • ChinesePDF EnglishNRB50 Series for Residue-Free Solder Paste
  • ChinesePDF EnglishPre-measured Solder Materials
  • ChinesePDF EnglishM24MT Low-Cost, Eco-Friendly Flow Soldering
  • ChinesePDF EnglishHigh-Reliability Soldering Materials
  • ChinesePDF EnglishSolder Spacers
  • ChinesePDF EnglishDie-Bond Soldering Materials
  • ChinesePDF EnglishPlating Anode
  • ChinesePDF EnglishSHF Series for Halogen-Free Soldering
  • ChinesePDF EnglishRAM Series for High Temperature
    Alternative Lead-Free Solder Paste
  • ChinesePDF EnglishM61 Solder Ball Material for
    Drop Impact Resistance
  • ChinesePDF EnglishIndustrial Analysis Service Ltd.
  • ChinesePDF EnglishCorporate Social Responsibility
    - Harmony with the Environment
  • ChinesePDF EnglishEliminating Conflict Minerals / Conflict Metals