Exhibition Handouts: INTERNEPCON JAPAN & IC PACKAGING TECHNOLOGY EXPO 2011

Catalogue

• ECOSOLDER CORED — Lead-Free Flux Cored Solder —

Leaflet

• FULL DOWNLOAD [11MB / 24 pages]
• Micro-Bumping Materials
• Solder Transfer using
  Precoated by Powder Sheets (PPS)
• Micro-Bumping Solder Paste
• M705-TVA-HF Transfer Paste
• Soldering Flux for Semiconductors
• Low-Silver Flow Soldering Materials
• M40 Series of Low-Cost,
  High-Quality Low-Silver Solder Pastes
• Lineup of Flux-Cored Solders
• Sn-Bi Solder Paste with Joint-Reinforcing Function
• L20 & L23 Solder for Low-Temperature Soldering
• NRB50 Series for Residue-Free Solder Paste
• Pre-measured Solder Materials
• M24MT Low-Cost, Eco-Friendly Flow Soldering
• High-Reliability Soldering Materials
• Solder Spacers
• Die-Bond Soldering Materials
• Plating Anode
• SHF Series for Halogen-Free Soldering
• RAM Series for High Temperature
  Alternative Lead-Free Solder Paste
• M61 Solder Ball Material for
  Drop Impact Resistance
• Industrial Analysis Service Ltd.
• Corporate Social Responsibility
  - Harmony with the Environment
• Eliminating Conflict Minerals / Conflict Metals
• SCQI Award from Intel Corporation