SMIC and Intel's Co-authored Paper Receives the Best Session Paper Award at ECTC

July 15, 2009

Senju Metal Industry and Intel Corporation's co-authored paper has received the “Best Session Paper" award from the Electronic Components and Technology Conference, selected from the 58th ECTC technical sessions held in Orlando, Florida in 2008.

The paper is the result of a SMIC-Intel research and development on the low-temperature solder, conducted over a period of more than a half year.

Paper Title

Material Design and Package-Level Reliability of a Novel Low-Temperature Solder Based on Intermetallic-Compound Phases with Superior High-Homologous Temperature Properties

Authors

Daewoong Suh and Chi-Won Hwang – Intel Corporation
Minoru Ueshima and Jun Sugimoto – Senju Metal Industry Company, Limited