Licensees of Set License of Sn-Ag-Cu Lead-Free Solder

The following solder suppliers in Japan have been granted a set license* of Sn-Ag-Cu Lead-Free Solder which described hereunder:

*A set license means a license which combines 1. the patent of Senju Metal Industry Co., Ltd. and 2. the sublicense of Nihon Superior Co., Ltd.

1. Senju Metal: Patent No. JP 3027441
2. Nihon Superior: The right to bring into the United States the products having the solder joint under the sublicense of Patent No. US 5527628.

Alphabetical List

Arakawa Chemical Industries, Ltd.
Asahi Chemical Research Laboratory Co., Ltd.
Cookson Electronics Co.
Fukuda Metal Foil & Powder Co., Ltd.
Harima Chemicals, Inc.
Hitachi Metals, Ltd.
Ishikawa Metal Co., Ltd.
Kojima Solder Co., Ltd.
Koki Company Ltd.
Matsuo Handa Co., Ltd.
Mitsubishi Materials Corporation
Mitsui Mining & Smelting Co., Ltd.
Nihon Almit Co., Ltd.
Nihon Genma MFG. Co., Ltd.
Nihon Handa Co., Ltd.
Nippon Filler Metals, Ltd.
Nippon Micrometal Corporation
Sanwa Chemical Ind. Co., Ltd.
Solder Coat Co., Ltd.
Taiho Kogyo Co., Ltd.
Tamura Kaken Corporation
Tarutin Kester Co., Ltd.
Uchihashi Estec Co., Ltd.
Yamaishi Metals Co., Ltd.

Applications and inquiries:

Senju Metal Industry Co., Ltd.
Intellectual Property Management Section
Phone: +81-3-3888-5155
Fax: +81-3-3870-1946
E-mail: web@senju-m.co.jp